Email Kami :
info@labcompanion.cn-

-

Hubungi Kami :
+86 18688888286
As core equipment for environmental reliability testing, rapid‑rate temperature change test chambers apply fast‑changing thermal stress to products. This accelerates and exposes early failures caused by defects in electronic components, parts or manufacturing processes, enabling failure elimination in advance.
In industries including semiconductors, automotive electronics, new energy, aerospace and 5G communications, temperature cycling testing is an indispensable reliability validation procedure before product release. With rising requirements for products’ thermal‑stress resistance, rapid temperature‑change capability has evolved from an optional feature into a mandatory test requirement.
A decade ago, the domestic market for rapid‑rate temperature change test chambers was largely dominated by imported solutions. Early local models generally delivered only 3‑5℃/min temperature‑change rates with non‑linear control. Actual time to reach target temperature far exceeded theoretical values, making it difficult to meet strict requirements for temperature‑change rates and cycle counts defined by standards such as GJB 1032 and IEC 60068.
After more than ten years of technology accumulation, domestic rapid‑rate temperature change test chambers have achieved substantial improvements in temperature ramping rate, temperature control accuracy and long‑term operational stability. At equivalent performance levels, domestic equipment costs stand at 50%‑70% of imported units. Local suppliers offer faster supply‑chain response, and replacement lead‑time for core components can be shortened to 3‑5 working days.
Temperature range constitutes the fundamental performance indicator. Current mainstream domestic models cover ‑70℃ to +150℃, delivering a total temperature span of 220℃. For extreme‑condition testing of automotive‑grade chips and aerospace‑specific chips, custom‑built versions with ultra‑wide range of ‑80℃ to +200℃ are available.
Temperature‑change rate is the core metric for evaluating chamber performance. Domestic equipment supports multiple selectable rates: 5℃/min, 10℃/min, 15℃/min, 20℃/min and 25℃/min. Under linear mode, temperature varies constantly over the full ramp‑up and ramp‑down cycle, ensuring thermal stress applied to test samples aligns with standard test assumptions.
Temperature‑control accuracy directly determines test‑data validity. Mature domestic chambers achieve temperature fluctuation ≤±0.5℃, temperature deviation ≤±2℃, and chamber‑wide temperature uniformity ≤±2℃ under full‑load conditions. These performances satisfy requirements from standards including GB/T 2423.22 and IEC 60068‑2‑14.
Chamber volume shall match sample dimensions and test batch size. Standard domestic models range from 80L to 1000L, while large‑size non‑standard customization is supported to cover testing from small‑component specimens to full‑scale complete units.
Most systems adopt binary cascade refrigeration, equipped with world‑class compressors together with electronic expansion valves and solenoid valves, enabling stable operation at extreme low temperature of ‑70℃. Locally‑developed intelligent controllers are widely deployed, featuring color touch‑screen HMI, multi‑segment program editing, automatic data acquisition and report generation.
Lab Companion was founded in 2005 in Dongguan, China. As a National High‑Tech Enterprise and Guangdong Provincial Specialized‑Refined‑Innovative Enterprise, we have over 20‑year expertise in environmental reliability test equipment.
Our operations comply with ISO9001, ISO14001, ISO45001 and ISO27001 management systems, and products carry CE certification for EU markets. With manufacturing bases in Dongguan headquarters, Kunshan and Chongqing, Lab Companion maintains a nationwide technical‑service network.
The refrigeration system applies binary cascade refrigeration with premium‑brand compressors, solenoid valves and flow control valves for stable continuous operation down to ‑70℃.
Lab Companion self‑developed cold‑balance energy‑saving control technology reduces energy waste caused by simultaneous heating‑and‑cooling conflict in conventional chambers. Actual energy consumption is reduced by 30%‑60% compared with industry‑average counterparts.
The in‑house developed intelligent control platform is fitted with large‑size color touch screen. It supports multi‑segment program editing, automatic data logging and one‑click report generation. Network communication enables remote monitoring and centralized management of multiple test units.
TC‑Series complies with general environmental‑test specifications IEC 60068‑2‑14 and GB/T 2423.22. It also meets military‑standard requirements of GJB 150A and MIL‑STD‑810H for both gradual temperature cycling and abrupt temperature change tests. Its ramping‑rate performance satisfies the environmental‑stress‑screening requirements specified in GJB 1032‑90.
Semiconductor Industry: Perform temperature cycling testing per JESD22‑A104 to validate reliability of packaging and solder‑joint interfaces under alternating thermal stress. The chamber supports hundreds to thousands of consecutive test cycles and covers mainstream ‑40℃ ~ +125℃ cycling conditions for automotive‑grade chips.
Automotive Electronics: Temperature range and ramping rates fulfill AEC‑Q100 and ISO 16750‑4 temperature‑cycling requirements. Suitable for reliability validation of automotive chips, domain controllers, BMS and other vehicle‑mounted components.
New‑Energy Industry: Reproduces extreme high‑low‑temperature conditions for large‑size samples such as battery modules and electronic control units. Sufficient temperature envelope and full‑load ramping rates support limit reliability verification for new‑energy three‑electric systems.
Aerospace Industry: Custom‑extended temperature range reaches ‑70℃ ~ +220℃, equipped with self‑developed dual‑PID closed‑loop control. It simulates drastic temperature shifts between sun‑exposed and shadowed aerospace environments to verify structural integrity and functional performance of products under extreme thermal variations.
Prioritize the ramping‑rate requirements defined by target test standards. Requirements differ significantly across specifications:
Select rate grades according to actual test specifications to avoid over‑specification or insufficient performance.
Catalog‑stated ramping rates are divided into no‑load rate and full‑load rate. For samples with thermal mass, full‑load rate represents the real‑world effective performance for testing.
All published rates for Lab Companion TC‑Series are measured under full‑load conditions. During selection, provide sample weight and heat‑dissipation data so our engineers can evaluate real‑world ramping performance under loaded conditions.
Determine chamber volume based on sample dimensions and loading method. For powered‑on testing with external wiring, reserve extra internal space for cable routing. Lab Companion provides non‑standard customization from 80L‑8000L, with optional test‑port and data‑logging interfaces to satisfy electrical‑test requirements.
Upon equipment delivery, engage a CNAS‑accredited metrology institute to perform calibration in accordance with JJF 1101‑2019 and obtain formal calibration reports. During acceptance, measure temperature overshoot, deviation, fluctuation and uniformity across all rate segments to verify compliance against technical agreements.
Thanks to years of technical advancement, domestically‑manufactured rapid‑rate temperature change test chambers have become highly competitive in ramping capability, temperature‑control accuracy and system stability.
Lab Companion TC‑Series rapid‑rate temperature change test chamber features wide temperature range of ‑70℃ ~ +150℃, multiple full‑load rates from 5℃/min to 25℃/min, temperature fluctuation ≤±0.5℃, binary cascade refrigeration and self‑developed intelligent control system. Supported by manufacturing capacity in Dongguan and customization capability covering 80L‑8000L, Lab Companion delivers complete temperature‑change testing solutions from R&D validation to mass‑production environmental stress screening for semiconductor, automotive‑electronics, new‑energy and aerospace sectors. Detailed specifications and configurations can be further discussed based on your actual test requirements.